Tessera Technologies Inc. (TSRA), the technology licensing company run by CEO Tom Lacey, said its Invensas Corp. unit signed a licensing agreement with Fraunhofer EMFT to incorporate Invensas' ZiBond and Direct Bond Interconnect technologies into its portfolio of foundry services.
The terms of the licensing agreement were not disclosed.
ZiBond and DBI technologies are cost-effective, versatile 2.5D and 3D semiconductor integration solutions that enable leading edge functionality and accelerate time to market for MEMS and multiple other semiconductor products. ZiBond and DBI bonding can be performed at room temperature without requiring bond pressure. Bonding is typically completed in less than a minute for an entire wafer, substantially reducing manufacturing cost.
"Scaling based on Moore's Law is becoming increasingly challenging and this is driving demand for our ZiBond and DBI bonding and 3D interconnect technologies, which have been proven in high volume production environments," said Craig Mitchell, president of Invensas in a statement. "We are pleased that Fraunhofer EMFT, a highly respected MEMS research and 3D heterogeneous integration, development and pilot manufacturing center of excellence, has chosen our ZiBond and DBI technologies to help their customers accelerate the development and commercialization of their next generation MEMS products."
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